| US Patent |
Other Patent |
Title |
7,327,452
(February 5, 2008) |
|
Light Beam Apparatus and Method for Orthogonal Alignment of Specimen |
7,323,862
(January 29, 2008) |
|
Contactless measurements of voltage characteristics of dynamic electrical signals in integrated circuits |
7,314,767
(January 1, 2008) |
|
Method for Local Wafer Thinning and Reinforcement |
7,297,948
(November 20, 2007) |
|
Column Simultaneously Focusing a Particle Beam and an Optical Beam |
7,257,507
(August 14, 2007) |
|
System and Method for Determining Probing Locations on IC |
7,245,133
(July 17, 2007) |
|
Integration of Photon Emission Microscope and Focus Ion Beam |
7,243,039
(July 10, 2007) |
|
System and Method for Determining Probing Locations on IC |
7,230,240
(June 12, 2007) |
|
Enhanced Scanning Control of Charged Particle Beam Systems |
7,228,464
(June 5, 2007) |
|
PICA System Timing Measurement & Calibration |
7,227,702
(June 5, 2007) |
|
Bi-Convex Solid Immersion Lens |
7,227,580
(June 5, 2007) |
|
Knife Edge Tracking System and Method |
7,224,828
(May 29, 2007) |
Taiwan I256097 |
Time Resolved Non-Invasive Diagnostics System |
7,115,426
(October 3, 2006) |
|
Method and Apparatus for Addressing Thickness Variations of a Trench Floor Formed in a Semiconductor Substrate |
7,135,678
(November 14, 2006) |
|
Charged Particle Guide |
7,135,123
(November 14, 2006) |
|
Method and System for Integrated Circuit Backside Navigation |
7,123,035
(October 17, 2006) |
|
Optics Landing System and Method Therefor |
7,113,630
(September 26, 2006) |
|
PICA System Detector Calibration |
7,102,374
(September 5, 2006) |
|
Spray Cooling Thermal Management System and Method for Semiconductor Probing, Diagnostics, and Failure Analysis |
7,060,196
(June 13, 2006) |
|
FIB Milling of Copper over Organic Dielectrics |
7,049,593
(May 23, 2006) |
France 2812455 |
Superconducting Single Photon Detector |
7,045,791
(May 16, 2006) |
Germany 345871
France 2806527
Taiwan NI-203223 |
Column Simultaneously Focusing a Particle Beam and an Optical Beam |
7,042,647
(May 9, 2006) |
|
Scanning Optical System |
7,042,563
(May 9, 2006) |
|
Optical Coupling for Testing Integrated Circuits |
7,038,442
(May 2, 2006) |
|
Apparatus and Method for Detecting Photon Emissions from Transistors |
7,036,109
(April 25, 2006) |
|
Imaging Integrated Circuits with Focused Ion Beam |
7,012,537
(March 14, 2006) |
|
Beacon Circuit for Photo Emission Voltage Analysis |
7,009,173
(March 7, 2006) |
|
Lens Mount Integrated with a Thermoelectrically Cooled Photodetector Module |
6,985,219
(January 10, 2006) |
|
Optical Coupling for Testing Integrated Circuits |
6,976,234
(December 13, 2005) |
|
Apparatus & Method for Measuring Characteristics of Dynamic Electrical Signals in Integrated Circuits |
6,967,491
(November 22, 2005) |
|
Spatial and Temporal Selective Laser Assisted Fault Localization |
6,961,672
(November 1, 2005) |
|
Universal Diagnostic Platform for Specimen Analysis |
6,958,248
(October 25, 2005) |
|
Method and Apparatus for the Improvement of Material/Voltage Contrast |
6,956,365
(October 18, 2005) |
|
System and Method for Calibration of Testing Equipment using Device Photoemission |
6,955,930
(October 18, 2005) |
|
Method and Apparatus for Determining Thickness of a Semiconductor Substrate at the Floor of a Trench |
6,943,572
(September 13, 2005) |
|
Apparatus and Method for Detecting Photon Emissions from Transistors |
6,939,209
September 6, 2005() |
|
Method for Backside Die Thinning and Polishing of Packaged Integrated Circuits |
6,905,623
(June 14, 2005) |
|
Precise, In-situ Endpoint Detection for Charged Particle Beam |
6,891,363
(May 10, 2005) |
|
Apparatus and Method for Detecting Photon Emissions from Transistors |
6,872,581
(March 29, 2005) |
|
Measuring Back-Side Voltage of an Integrated Circuit |
6,859,031
(February 22, 2005) |
Korea 734186
Taiwan 1264791 |
Apparatus and Method for Dynamic Diagnostic Testing of Integrated Circuits |
6,855,622
(February 15, 2005) |
|
Method and Apparatus for Forming a Trench Through a Semiconductor Substrate |
6,853,941
(February 8, 2005) |
|
Open-Loop for Waveform Acquisition |
6,848,087
(January 25, 2005) |
|
Sub-Resolution Alignment of Images |
6,836,131
(December 28, 2004) |
Taiwan I 251067 |
Spray Cooling and Transparent Cooling Plate Thermal Management System |
6,828,811
(December 7, 2004) |
|
Optics Landing System and Method Therefor |
6,825,978
(November 30, 2004) |
Singapore 106891
Korea 433311 |
High Sensitivity Thermal Radiation Detection with an Emission Microscope with Room Temperature Optics |
6,824,655
(November 30, 2004) |
|
Process for Charged Particle Beam Micro-Machining of Copper |
6,819,117
(November 16, 2004) |
|
PICA System Timing Measurement & Calibration |
6,812,464
(November 2, 2004) |
Taiwan 166651 |
Superconducting Single Photon Detector |
6,797,581
(September 28, 2004) |
|
Avalanche Photo Diode for Photon Counting Applications and Method Thereof |
6,781,218
(August 24, 2004) |
|
Method and Apparatus for Accessing Internal Nodes of an Integrated Circuit Using IC Package Substrate |
6,778,327
(August 17, 2004) |
Taiwan I 249622 |
Bi-Convex Solid Immersion Lens |
6,744,267
(June 1, 2004) |
Singapore 108393 |
Test System and Methodology |
6,737,853
(May 18, 2004) |
|
Photoconductive-Sampling Voltage Measurement |
6,731,327
(May 4, 2004) |
|
Dynamic Structural Coupling Mechanism for Reducing Optical Degradation in Vibrating Environments |
6,720,588
(April 13, 2004) |
Taiwan 201324 |
Avalanche Photo Diode for Photon Counting Applications |
6,672,947
(January 6, 2004) |
|
Method for Global Die Thinning and Polishing of Flip-Chip Packaged Integrated Circuits |
6,630,667
(October 7, 2003) |
Taiwan 159509 |
Compact, High Collection Efficiency Scintillator for Secondary Electron Detection |
6,621,275
(September 16, 2003) |
|
Time Resolved Non-Invasive Diagnostics System |
6,594,086
(July 15, 2003) |
EPC 1466194 |
Bi-Convex Solid Immersion Lens |
6,518,571
(February 11, 2003) |
|
Through the Substrate Investigation of Flip-Chip ICs |
6,501,288
(December 31, 2002) |
Taiwan 197139 |
On-Chip Optically Triggered Latch for IC Time Measurements |
6,496,261
(December 17, 2002) |
Taiwan 194194 |
Double-Pulsed Optical Interferometer for Waveform Probing of Integrated Circuits |
6,462,814
(October 8, 2002) |
Taiwan 161277 |
Beam Delivery and Imaging for Optical Probing of a Device Operating under Electrical Test |
6,410,924
(June 25, 2002) |
|
Energy Filtered Focused Ion Beam Column |
6,252,222
(June 26, 2001) |
Taiwan 170491 |
Differential Pulsed Laser Beam Probing of Integrated Circuits |
6,225,626
(May 1, 2001) |
|
Through the Substrate Investigation of Flip-Chip ICs |
6,081,110
(June 27, 2000) |
Korea 0628445 |
Thermal Isolation Plate for Probe Card |
5,920,073
(July 6, 1999) |
|
Optical System with an Axially Moveable Apertured Plate |
5,905,577
(May 18, 1999) |
|
Dual-Laser Voltage Probing of ICs |
5,905,266
(May 18, 1999) |
Taiwan NI-121589 |
Charged Particle Beam System with Optical Microscope |
5,840,630
(November 24, 1998 ) |
Germany 69703611.1
Korea 10-510431
Taiwan NI-109360 |
FIB Etching Enhanced with 1,2 Di-Iodo-Ethane |
5,821,549
(October 13, 1998) |
|
Through the Substrate Investigation of Flip-Chip ICs |
5,747,818
(May 5, 1998) |
France 0838836
Germany 69724549.7 |
Thermoelectric Cooling Gas-Assisted FIB System |
5,731,984
(March 24, 1998) |
|
Vector-Based Waveform Acquisition and Display |
5,700,526
(December 23, 1997) |
|
Insulator Deposition Using Focused Ion Beam |
5,698,474
(December 16, 1997) |
|
High Speed Diamond-Based Machining of Silicon Semiconductor Die in Wafer and Packaged Form for a Backside Emission Microscope Detection |
5,675,499
(October 7, 1997) |
|
Method of Probing a Net of an IC at an Optimal Probe-Point |
5,638,005
(June 10, 1997) |
|
Predictive Waveform Acquisition |
5,616,921
(April 1, 1997) |
|
Self-Masking FIB Milling |
5,604,819
(February 18, 1997) |
|
Determining Offset between Images of an IC |
5,530,372
(June 25, 1996) |
|
Method of Probing a Net of an IC at an Optimal Probe-Point |
5,475,316
(December 12, 1995) |
|
Transportable Image Emission Microscope |
5,401,972
(March 28, 1995) |
|
Layout Overlay for FIB Operations (Includes electronic beam deflection) |
| |
Japan 3633993 |
Optimal Probe Point Placement |
5,392,222
(February 21, 1995) |
|
Locating a Field of View in which Selected IC Conductors are Unobscured |
5,357,116
(October 18, 1994) |
|
Focused ION Beam Processing with Charge Control |
5,210,487
(May 11, 1993) |
|
Double-Gated Integrating Scheme for Electron Beam Tester |
5,282,088
(January 25, 1994) |
|
Aplanatic Microlens and Method for Making Same |
5,270,643
(December 14, 1993) |
|
Pulsed Laser Photoemission Electron-Beam Probe |
5,144,225
(September 1, 1992) |
|
Methods and Apparatus for Acquiring Data from Intermittently Failing Circuits |
5,127,064
(June 30, 1992) |
|
High Resolution Image Compression Methods and Apparatus |
5,054,097
(October 1, 1991) |
|
Methods and Apparatus for Alignment of Images |
4,912,405
(March 27, 1990) |
|
Magnetic Lens and Electron Beam Deflection System |
